Advanced Electronics
Redefining microelectronics with ultra-conductive nano-inks.
Thinner. Lighter. Flexible.
A subsidiary of GenesInk Group, GNKELEC develops conductive nano-solutions that enable the printing of ultra-thin, lightweight, and high-performance electronic circuits.
At the crossroads of materials chemistry, microelectronics, and industrial design, GNKELEC redefines how systems and subsystems are conceived, integrated, and manufactured.
When conventional solutions reach their limits,
GNKELEC turns design constraints into design freedom.
Key Markets
System-in-Package (SiP), Defense & Aerospace, MedTech, Automotive, IoT & Wearables, Smart Packaging, premium consumer electronics.
Challenges
Weight reduction, complex form factors, ultra-miniaturization, mechanical constraints, flexible and heat-sensitive substrates.
What GNKELEC Unlocks
Maximum conductivity with minimal material: up to 4x more conductive with 10x less material (under certain conditions*), 5x thinner and 4x more conductive (nano vs micro).
GNKELEC supports manufacturers, OEMs, laboratories and integrators across the entire development cycle, from formulation customization to technology transfer under license.
Our formulations integrate naturally into the ergonomics of your products and the elegance of your designs, while securing your production lines.
Explore our applicationsKey Performances
// Competitive Advantages
Close to silver bulk.
Fine line printing.
Ultra-thin profile.
Low Ra surface.
Bending radius.
Lighter than copper * EMI shielding
// Compatible with all printing methods – except offset
Ultra-Fine Lines
Pushing the limits of miniaturization with resolution down to 1.2 μm, enabling high-density interconnects invisible to the naked eye for next-gen circuits.
- 1.2 μm Resolution
- High Density Interconnects
EMI Shielding
Our conformal coatings replace bulky metal cans with ultra-thin conductive coatings, up to 35x thinner and 96.7% lighter than conventional shielding.
- Conformal Coating
- 30x lighter than copper
Thermal Management
Efficiently dissipating heat in increasingly compact devices. Our materials ensure optimal performance and longevity through superior thermal conductivity.
- Heat Spreading
- Device Reliability
Offer
// From R&D to Licensing
Prototyping
Pattern optimization and prototyping on target substrates.
Formulation Co-development
Adaptation to support performance objectives.
Process Engineering
Seamless integration into existing manufacturing lines.
Operating Licenses
Technology transfer for autonomous operation.
Prototyping
From idea to functional product: faster, simpler, with the right technologies.
Our ambition is to accelerate time to market by drastically reducing the time between the initial idea and the first functional prototype.
Depending on your needs and desired level of autonomy, we offer:
- ›Complete testing and printing carried out by our teams.
- ›Hands-on support in using the equipment available at our facility.
- ›Integration of electronic components onto printed circuits — Coming Soon.
// core Offer
Formulation Co-development
Proven formulations. Expertise to evolve them.
Our formulation portfolio is a scalable technology foundation for your developments.
Accelerate your time to market
Mature, industrializable formulations designed to reduce your qualification phases.
Easily integrate our formulations into your processes
Broad compatibility with all industrial printing processes and a wide range of substrates, including flexible and heat-sensitive ones.
Create products your competitors cannot design
We select the formulation best suited to your application, then customize it when your project demands unprecedented performance.
Product Families
// Our Technologies
Semiconductive Inks
Key Uses
Functional layers (ETL, HTL, top electrode), organic & perovskite active layers
Key Functionalities
Charge transport control, Layer uniformity & crystallization
High Performance Conductive Inks
Key Uses
High-performance electrical conductivity, micron-scale printing resolution, electrical continuity on fine lines, performance-to-material-cost optimization.
Key Functionalities
Charge transport control, Layer uniformity & crystallization
Transparent Conductive Inks
Key Uses
Fine transparent lines & circuits, Transparent flexible electrodes & ITO replacement layers for photovoltaics
Key Functionalities
High transmittance, High optoelectronic FoM, Haze control, Mechanical flexibility
// Universal Compatibility
Methods
Substrates
// Advanced Electronics
High-Performance Conductive Inks
High-performance silver conductive inks for fine lines, bus bars and printed circuits. Filter by printing process and request the technical data sheet.
| Printing process | Resistivity (µΩ·cm) | Temperature | Technical Data Sheet | Reference |
|---|
Request the Technical Data Sheet
// In the Press
Scientific Publications
Selected news, partnerships and publications around our advanced electronics inks.
Process Engineering
Optimize printing processes and ensure result reproducibility.
GNKELEC supports industrial partners and system integrators in the operational deployment of our solutions within their production lines. Our approach ensures optimal and compliant use of our technologies, taking into account your equipment.
Identification
Of technical challenges and process bottlenecks before integration.
Control
Ensuring fully controlled and reproducible printing processes.
Performance
Achieving conductivity and resolution levels aligned with expectations.
Efficiency
Optimized setup and parameterization time for faster production.
Operating Licenses
Technology transfer for autonomous use of our expertise within a defined geographical or industrial scope.
Ready to Scale?
From pilot lines to mass production.